ATS Engineering’s Failure Analysis, FA, Department supports its OEM customers’ needs in collecting and analyzing data to determine the cause of engineering failures. Our combination of competent engineers, supporting technical staff and equipped engineering facility provide the OEM with rapid turnaround time in providing professional responses, shorter down time and assist the OEM in improving his ability to supply higher quality end products. Within our FA services we support:
PCB First Article Inspection
Device level FA
PCB and PCA quality auditing
DPA – Destructive Physical Analysis
Semicondutor, Discrete and MEMS Failure analysis
PCB Failure analysis
Authenticity (counterfeit inspection)
Reverse engineering of semiconductors for competitive analysis
Dicing, Grinding & Polishing including backside sample preparation
Optical Microscopes with Image Analysis
Scanning Electron Microscope with EDS
SAM (Scanning Acoustic Microscope)
IC Plastic Package Decapsulation
Die shear test
Solder Dip Test
Wire Bond Pull testers
“DYE - n - PRY” test for BGAs
ATS Engineering provides the OEM with an ISO 9001 qualified facility for the testing of digital and mixed signal silicon, germanium and gallium arsenide semiconductor devices. Whether single discrete devices or integrated circuits (ICs), the ATS Engineering Test Solutions center provides OEMs with a locally present facility to test wafers, substrates and mini-series production output before ramping up to full production.
PRINTED CIRCUIT BOARDS
OEM customers require a range of test solutions for their single sided, double sided or multi-layer component loaded Printed Circuit Board Assemblies (PCBA) or bare PCBs (Printed Circuit Boards). ATS Engineering offers test and inspection strategies including Manual Visual Inspection (MVI), In-Circuit Test (ICT) and Functional Test (FT).
The ATS Engineering facility, headquartered in Migdal Haemek, provides the OEM manufacturer with Authenticity Testing of PCB components used in critically important electronic systems.Counterfeit components can pose a danger to the health, safety and security of the public due to their inferior quality and reliability. ATS Engineering designs and builds hardware to conduct electrical screen testing to meet device specifications and confirm its authenticity.
Authenticity Testing ensures a more dependable Supply Chain satisfying the needs of the OEM manufactures and providing the End User (consumer) with reliable products used in Communication, Medical, Defense, Aerospace and other Special Industrial applications.
C-SAM (Confocal Scanning Acoustic Mircoscopy) implements the use of an acoustic microscope to identify delamination, cracks, voids, counterfeit parts, proper bonding of layers and adherence to specification. The product under examination, whether electronic device, printed circuit board or other assembly, is not destroyed in the process. The test results, displayed on an oscilloscope, help the user pinpoint the specific depth of the problematic areas enabling investigation.
This destructive technique enables to inspect the construction and/or composition at a section of the components, substrate and solder joints after cutting it appart. When applicable, the sample can be molded in resin to alleviate chipping or destruction of the sample during polishing.
DYE and PRY test for BGAs
This is a dye penetrant method that can be used during assembly process set-up and in failure analysis to detect solder joint cracking and wetting problems, and package delamination. The sample is immersed in a low viscosity liquid dye which penetrates any cracks, delaminated areas ,or open voids. Afterwards, the sample is pried out and examined for the presence of dye in the solder joint or at material interface. This destructive method is very useful for major problems identification.
X-Ray Inspection Systems allow 2D or 3D automated or manual inspection of solder joints and other features of electronic devices, PCBs (printed circuit boards) and other electronic components.