Failure Analysis

ATS Engineering’s Failure Analysis Department supports its OEM customer's needs in collecting and analysing data to determine the cause of failures, either engineering, manufacturing or material failures. Our combination of competent engineers, supporting technical staff and equipped laboratories provide the OEM with rapid turnaround time in providing professional responses, shorter down time and assist the OEM in improving his ability to supply higher quality and higher reliability products. Within our FA services we support:

  • PCB First Article Inspection
  • Cross sectioning
  • Optical Microscopes with Image Analysis
  • Scanning Electron Microscope with EDS
  • X-ray Imaging
  • SAM (Scanning Acoustic Microscope)
  • Die shear test
  • Solder Dip Test
  • Wire Bond Pull testers
  • Hermeticity Testing
  • Die and Pry Testing
  • PCB auditing
  • IC Plastic Package Decapsulation


This destructive technique enables to inspect the construction and/or composition at a section of the components,
substrate and solder joints after cutting it apart.
When applicable, the sample can be molded in resin to alleviate chipping or destruction of the sample during polishing.  


OEM customers require a range of test solutions for component loaded Printed Circuit Board Assemblies (PCBA) or bare PCBs (Printed Circuit Boards).
ATS Engineering offers test and inspection strategies including Manual Visual Inspection (MVI), In-Circuit Test (ICT) and Functional Test (FT).


The ATS Engineering facility, headquartered in Migdal Haemek, provides the OEM manufacturer with Authenticity Testing of PCB components used in critically important electronic systems. Counterfeit components can pose a danger to the health, safety and security of the public due to their inferior quality and reliability.
ATS Engineering designs and builds hardware to conduct electrical screen testing to meet device specifications and confirm its authenticity.
Authenticity Testing ensures a more dependable Supply Chain satisfying the needs of the OEM manufactures and providing the End User (consumer) with reliable products used in Communication, Medical, Defence, Aerospace and other Special Industrial applications.


C-SAM (Confocal Scanning Acoustic Microscopy) implements the use of an acoustic microscope to identify delamination, cracks, voids, counterfeit parts, proper bonding of layers and adherence to specification.
The product under examination, whether electronic device, printed circuit board or other assembly, is not destroyed in the process.
The test results, displayed on an oscilloscope, help the user pinpoint the specific depth of the problematic areas enabling investigation.


ATS Engineering provides the OEM with an ISO 9001 qualified facility for the testing of digital and mixed signal silicon, germanium, and gallium arsenide semiconductor devices.
Whether single discrete devices or integrated circuits (ICs), the ATS Engineering Test Solutions center provides OEMs with a locally present facility to test wafers, substrates, and mini-series production output before ramping up to full production.

DYE and PRY test for BGAs

X-Ray Inspection Systems allow 2D or 3D automated or manual inspection of solder joints and other features of electronic devices, PCBs (printed circuit boards) and other electronic components.


X-Ray Inspection Systems allow 2D or 3D automated or manual inspection of solder joints and other features of electronic devices, PCBs (printed circuit boards) and other electronic components.

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