Once soldered SMD components normally can only be removed from the printed circuit board or substrate by using de-soldering processes applying massive heat to the device. With the novel ONYX Milling machine, SMD components can be milled off the substrate very precisely. A clean surface results, perfect for the placement and soldering of new components.

Main Features

  • High frequency precision spindle up to 80`000 min-1
  • Entire process without any tool change
  • Different tools with e.g. diamond coating
  • Automatic tool calibration in X / Y and Z direction
  • X and Y linear motors
  • Precise process accuracy, precision in μm
  • Integrated exhaust device of the processing head
  • Down looking image data processing
  • Circuit board holder
  • ONYX Milling application software

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