ONYX MILLING
Once soldered SMD components normally can only be removed from the printed circuit board or substrate by using de-soldering processes applying massive heat to the device. With the novel ONYX Milling machine, SMD components can be milled off the substrate very precisely. A clean surface results, perfect for the placement and soldering of new components.
Main Features
- High frequency precision spindle up to 80`000 min-1
- Entire process without any tool change
- Different tools with e.g. diamond coating
- Automatic tool calibration in X / Y and Z direction
- X and Y linear motors
- Precise process accuracy, precision in μm
- Integrated exhaust device of the processing head
- Down looking image data processing
- Circuit board holder
- ONYX Milling application software
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